What Material Is Used for PCB Via Filling? Filling Material Type Advantages Applications Cost Non-Conductive Epoxy Stable performance, cost-effective, smooth via-in-pad surface HDI boards, smartphones, tablets, consumer electronics, BGA via-in-pad Low Conductive Epoxy Enhanced thermal/electrical conductivity Power modules

Laying out your custom PCB starts with strategy. A great schematic won’t save a poor layout, especially for fast signals or complex systems. Here’s a professional approach to DIY or low-volume layout: 1. Start with a block-level floorplan: Divide your circuit into sections (power, MCU, analog, RF, connectors) and place them logically.

Via filling of Printed Circuit Board refers to the process of depositing conductive or non-conductive material into a drilled hole so the entire via barrel becomes a solid structure. The goal is to create a stable foundation for surface plating, improve mechanical strength, and prevent solder from flowing into the via during assembly. Becau